Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. Kazimieras Gaivenis, Gytis Juška, Vidas Kalesinskas. 2000.
Wafer testing — is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying… … Wikipedia
Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… … Wikipedia
Wafer prober — A wafer prober is a machine used to test integrated circuits. OverviewIntegrated circuits are fabricated in large numbers by a complex series of printing steps on silicon wafers. This process permits integrated circuits to be produced cheaply but … Wikipedia
Design for testing — Design for Test (aka Design for Testability or DFT ) is a name for design techniques that add certain testability features to a microelectronic hardware product design. The premise of the added features is that they make it easier to develop and… … Wikipedia
Testwafer zur Durchführung der Prozeßkontrolle — technologijos tikrinimo plokštelė statusas T sritis radioelektronika atitikmenys: angl. process testing wafer vok. Testwafer zur Durchführung der Prozeßkontrolle, m rus. пластина для контроля технологического процесса, f pranc. tranche de test… … Radioelektronikos terminų žodynas
technologijos tikrinimo plokštelė — statusas T sritis radioelektronika atitikmenys: angl. process testing wafer vok. Testwafer zur Durchführung der Prozeßkontrolle, m rus. пластина для контроля технологического процесса, f pranc. tranche de test pour contrôle du processus, f … Radioelektronikos terminų žodynas
tranche de test pour contrôle du processus — technologijos tikrinimo plokštelė statusas T sritis radioelektronika atitikmenys: angl. process testing wafer vok. Testwafer zur Durchführung der Prozeßkontrolle, m rus. пластина для контроля технологического процесса, f pranc. tranche de test… … Radioelektronikos terminų žodynas
пластина для контроля технологического процесса — technologijos tikrinimo plokštelė statusas T sritis radioelektronika atitikmenys: angl. process testing wafer vok. Testwafer zur Durchführung der Prozeßkontrolle, m rus. пластина для контроля технологического процесса, f pranc. tranche de test… … Radioelektronikos terminų žodynas
Die preparation — Wafer glued on blue tape and cut into pieces Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer… … Wikipedia
Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 … Wikipedia
